UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays

Samtec UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays are 0.635mm pitch high-density, high-speed signal/power arrays that achieve 64Gbps PAM4 speeds. These Samtech signal/power arrays feature rotated power blades for improved performance and simplified breakout region (BOR). These UDx6 AcceleRate MP series features 5mm and 10mm stack heights and up to 10 power and 240 signal positions. The signal/power arrays offer an open-pin-field design for routing and grounding flexibility. The series includes optional alignment pins, standard weld tabs for a secure connection to the board, and polarized guide posts for blind mating.

結果: 40
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數量 RoHS ECAD模型 產品
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終端類型
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最高工作溫度
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觸點材料
外殼材料
系列
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
規格書
25預期2026/9/14
最少： 1
倍數： 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
規格書
25預期2026/9/7
最少： 1
倍數： 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
規格書
25預期2026/10/12
最少： 1
倍數： 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
規格書
25預期2026/10/20
最少： 1
倍數： 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
規格書
22預期2026/11/9
最少： 1
倍數： 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
規格書
25預期2026/10/19
最少： 1
倍數： 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
規格書
25預期2026/10/20
最少： 1
倍數： 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/9/21
最少： 1
倍數： 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/20
最少： 1
倍數： 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/19
最少： 1
倍數： 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/19
最少： 1
倍數： 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/19
最少： 1
倍數： 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/20
最少： 1
倍數： 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/7
最少： 1
倍數： 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/20
最少： 1
倍數： 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/19
最少： 1
倍數： 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/19
最少： 1
倍數： 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
22預期2026/10/19
最少： 1
倍數： 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/19
最少： 1
倍數： 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/20
最少： 1
倍數： 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/20
最少： 1
倍數： 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/20
最少： 1
倍數： 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
25預期2026/10/20
最少： 1
倍數： 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
規格書
25預期2026/9/14
最少： 1
倍數： 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
規格書
無庫存前置作業時間 10 週
最少： 350
倍數： 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6