IME1G08D3EEBG-15EI

Intelligent Memory
822-IME1G08D3EBG15EI
IME1G08D3EEBG-15EI

Mfr.:

Description:
DRAM ECC DDR3, 1Gb, 1.5V, 128Mx8, 667MHz (1333Mbps), -40C to +95C, FBGA-78

Lifecycle:
Factory Special Order:
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Datasheet:
ECAD Model:
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Product Attribute Attribute Value Select Attribute
Intelligent Memory
Product Category: DRAM
RoHS:  
SDRAM - DDR3
1 Gbit
8 bit
667 MHz
FBGA-78
128 M x 8
20 ns
1.425 V
1.575 V
- 40 C
+ 95 C
IME1G08D3
Tray
Brand: Intelligent Memory
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Product Type: DRAM
Factory Pack Quantity: 242
Subcategory: Memory & Data Storage
Supply Current - Max: 220 mA
Unit Weight: 244 mg
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Attributes selected: 0

Datasheet

Compliance Codes
CAHTS:
8542320020
USHTS:
8542320032
MXHTS:
8542320299
ECCN:
EAR99
Origin Classifications
Country of Origin:
Taiwan, China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Double Data Rate 3 (DDR3) DRAM

Intelligent Memory Double Data Rate 3 (DDR3) DRAM provides 1Gb to 16Gb densities for commercial and industrial applications. These ICs support Off-Chip Driver (OCD) impedance and On-Die Termination (ODT). The Intelligent Memory DDR3 DRAM features write leveling, programmable burst lengths, and CAS latency in FBGA-78 and FBGA-96 packages.

Dynamic Random Access Memory (DRAM)

Intelligent Memory Dynamic Random Access Memory (DRAM) includes a full range of JEDEC-compliant DRAMs and ECC DRAMs (SDRAM, DDR, DDR2, DDR3, DDR4, LPDDR4). From an application's point of view, these components work like a monolithic device. The DRAM devices allow for maximum levels of memory density without altering existing board layouts or designs.

Availability

Stock:
Non-Stocked
Factory Lead-Time:
26 Weeks Estimated factory production time.
Long lead time reported on this product.
Minimum: 242   Multiples: 242
Unit Price:
NT$-.--
Ext. Price:
NT$-.--
Est. Tariff:
This Product Ships FREE

Pricing (TWD)

Qty. Unit Price
Ext. Price
NT$848.93 NT$205,441.06

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