xGM260P無線模組

Silicon Labs xGM260P Wireless Modules are 2.4GHz frequency devices that deliver excellent RF performance. The MGM260P modules are based on the EFR32MG26 System-on-Chips (SoCs) and support Bluetooth®, Zigbee®, Thread, and Matter protocols. These MGM260P modules feature Secure Vault® technology and support various advanced debugging and development tools. The BGM260P modules are based on the EFR32BG26 SoCs and support Bluetooth Low Energy (BLE) and Bluetooth mesh. These xGM260P wireless modules are ideal for use in light bulbs and designs that require extra PCB layout flexibility.

結果: 6
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 製造商
說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。
數量 RoHS ECAD模型 系列
頻率
輸出功率
接口類型
電源電壓 - 最小值
電源電壓 - 最大值
最低工作溫度
最高工作溫度
尺寸
協議 - 藍牙、BLE (802.15.1)
協議 - ANT、Thread、Zigbee (802.15.4)
產品
封裝


Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
62庫存量
最少： 1
倍數： 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
177庫存量
最少： 1
倍數： 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
110庫存量
最少： 1
倍數： 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
31庫存量
100預期2026/10/9
最少： 1
倍數： 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
144庫存量
最少： 1
倍數： 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
23庫存量
最少： 1
倍數： 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape