Infineon Technologies XENSIV™ MEMS麥克風

英飛凌XENSIV MEMS麥克風即使在高聲壓位準 (SPL) 下也具有超低的自噪音（高SNR）和極低的失真 (THD)。這些麥克風也具備緊密的元件間相位和靈敏度匹配、具有低LFRO（低頻滾降）的平坦頻率回應，以及超低群延遲。這些MEMS麥克風的前述進階特性，結合可選擇的功率模式和小型封裝尺寸，使它們成為具有出色音訊擷取功能的消費性電子產品和預測性維護和安全性等特定工業應用的完美選擇。

IM69D128S

Great signal-to-noise ratio (SNR) of 69dB(A) enables a crystal clear audio experience without compromising on battery life. Enabled by a revolutionary digital microphone ASIC, the IM69D128S sets a benchmark by cutting current consumption to 520μA – almost half of what models with similar performance on the market can offer.  Additionally, IM69D128S masters the art of switching between different power and performance profiles without any audible artifacts, i.e., glitches that the user can hear.

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IM70D122

High performance digital XENSIV MEMS microphone IM70D122 makes the most out of Infineon´s Sealed Dual Membrane technology to meet a very high signal-to-noise ratio of 70dB(A) and a very high sensitivity of -26dBFS. Especially thanks to its high sensitivity and high SNR, the IM70D122 is perfectly tailored for advanced audio capturing, which can uplift the audio experience for laptops, tablets, cameras, and conference systems.

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IM73D122

超低雜訊數位XENSIV™ MEMS麥克風IM73D122是專為需要極高SNR（低自噪音）和高靈敏度的應用所設計。它透過平坦的頻率回應（20 Hz低頻滾降）和嚴格的製造公差，改善了多重麥克風（陣列）應用的效能。此麥克風採用英飛凌的密封雙膜MEMS技術，可提供麥克風層面的高防護等級 (IP57)。

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IM68A130

The IM68A130 is a high-performance, single-ended, analog MEMS microphone designed for applications that require a low LFRO (10Hz), a high SNR (low self-noise), and low distortion (high AOP). The high signal-to-noise ratio (SNR) of 68dB(A) enables far-field and low-volume audio pick-up. The flat frequency response and tight manufacturing tolerance improve the performance of Active Noise Cancellation (ANC) and multi-microphone array applications.

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IM70A135

Infineon’s XENSIV MEMS analog microphone IM70A135 is a compact, high-performance microphone with a very high acoustic overload point of 135dBSPL and a size of only 3.50mm x 2.65mm x 1.00mm³. This microphone is based on Infineon’s Sealed Dual Membrane MEMS technology, which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.

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IM72D128V01

IM72D128V01是一款超高效能的數位麥克風，專為需要極高SNR（低自噪音）和低失真（高AOP）的應用所設計。此麥克風採用英飛凌的密封雙膜MEMS技術，可提供麥克風層面的高防護等級 (IP57)。它透過平坦的頻率回應（20 Hz低頻滾降）和嚴格的製造公差，改善了多重麥克風（陣列）應用的效能。此麥克風可選擇不同的功率模式，以滿足特定的時脈頻率和電流消耗要求。

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IM69D127

IM69D127是一款採用英飛凌密封雙膜MEMS技術的數位高效能MEMS麥克風，可提供麥克風層面的高防護等級 (IP57)。此裝置小巧尺寸僅3.60 mm x 2.50 mm x 1.00 mm³，是TWS耳機等輕巧型音訊裝置的理想選擇。

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IM73A135

英飛凌XENSIV™ MEMS類比麥克風IM73A135具有73 dB的訊噪比 (SNR) 和135 dBSPL的高聲學過載點，能清晰地拾取最安靜和最響亮的聲音。IM73A135使設計人員能達到以前唯有透過ECM才能實現的高音訊效能水平，同時取得MEMS技術既有的優勢。

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IM69D129F

The IM69D129F low-power digital XENSIV™ MEMS microphone is designed for applications that require a digital PDM MEMS microphone with very low current consumption, high Signal-to-Noise Ratio (low self-noise), and low distortion (high AOP). This microphone features an omnidirectional pickup pattern, an acoustic overload point at 129dBSPL, and 450μA current consumption. Typical applications include laptops, tablets, IoT devices, cameras, and home automation.

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AUDIOHUB NANO

The Infineon Audiohub Nano Digital EVALAHNBDIGITALV01TOBO1 board enables the evaluation of Infineon analog XENSIV MEMS microphones. The kit includes an Infineon Audiohub Nano and four analog microphones on a flex board. Up to two Infineon analog XENSIV MEMS microphones can be connected to the mono or stereo output evaluation board. The evaluation board provides a USB audio interface to stream audio data from the microphone with any audio recording and editing software.

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