Laird Technologies CoolZorb 500 Hybrid Thermal/EMI Absorbers

Laird Technologies CoolZorb 500 Hybrid Thermal / Electromagnetic Interference (EMI) Absorbers suppress unwanted energy coupling, resonances, or surface currents with a 3.4g/cc density. The hybrid absorber / thermal management material is designed using a silicone gel binder that imparts inherent tack typical of standard thermal gap fillers. The filler particle composition provides both excellent thermal conductivity and good EMI suppression in the microwave frequency range, with ideal attenuation performance at or above 5GHz. Laird Technologies CoolZorb 500 Hybrid Thermal / EMI Absorbers are used as a traditional thermal interface material between a heat source, such as an IC, and a heat sink, another heat transfer device, or metal chassis.

No peel-and-stick adhesive is required, like with a traditional thermal interface material. The CoolZorb 500 series meets UL 94V-0 requirements and offers a cost-effective solution while still meeting compliance requirements.

Specifications

  • Dark gray color
  • 4.0W/m-K thermal conductivity
  • 3.4g/cc density
  • 55 shore 00 hardness
  • 45psi tensile strength
  • 1.0 x 1011Ω volume resistivity
  • Outgassing
    • TML: 0.093%
    • CVCM: 0.011%
  • EMI Attenuation
    • 9.4dB/cm (5GHz)
    • 17.3dB/cm (15GHz)
  • 118µm/mC coefficient of thermal expansion (CTE)
  • 0.5mm to 3.1mm standard thickness
  • ±.127mm thickness tolerance
  • -40°C to +175°C operating temperature range
  • UL 94V-0 UL flammability
  • RoHS and REACH compliant
發佈日期: 2017-11-29 | 更新日期: 2025-06-20