返回至Molex

Molex EXTreme PowerMass™ High-Current Connectors

Molex EXTreme PowerMass™ High-Current Connectors are designed to support power supplies and systems that require high-current transfer in challenging and thermal-constrained spaces. This high-current, board-to-board, hybrid power and signal, modular connector system provides 380A per linear inch current density. Molex EXTreme PowerMass is available in coplanar and right-angle to vertical board-to-board orientations. Applications include networking, telecommunications, and power supplies.

Features

  • Multiple power (150.0A, 80.0A, 40.0A) and signal (24 to 64 circuits) modules available
  • 350.0A per linear inch current density, 150.0A per circuit at +30°C temperature rise
  • Press-fit and solder-board termination
  • Less than 1mΩ resistance (plane-to-plane) at end-of-life
  • Die-cast or plastic guides
  • Modules assembled to metal stiffener
  • Variable power-blade and signal-pin lengths

Applications

  • Telecommunication equipment
    • Hubs
    • Cellular base stations
    • Switches
    • Routers
  • Data-communication equipment
    • High-end servers
    • Rack servers
  • Power supplies

Specifications

  • Voltage
    • 250V signal module
    • 600V for 150.0A module
    • Multi-path
      • 450V for the 80.0A module
      • 600V for the 40.0A module
  • Current at +30°C temperature rise
    • 3.0A per circuit in the signal module (24 to 64 circuits)
    • 150.0A module
    • 40.0A per circuit multi-path (4 circuits)
    • 40.0A per circuit for the 80.0A module (2 circuits)
    • 40.0A module
  • Contact resistance range per blade
    • 0.16mΩ to 10.0mΩ initial
    • 0.25mΩ to 10.0mΩ delta
    • 0.41mΩ to 20.0mΩ end of life
  • 5000MΩ minimum insulation resistance
  • 120g to 2920g mating force range
  • 65g to 1720g unmating force range
  • 225g contact retention
  • 50-cycle durability
  • -40°C to +105°C operating temperature range
  • UL 94V-0 rated
  • LCP housing
  • Copper (Cu) Alloy contacts
  • Plating
    • 30µ" Gold (Au) minimum in the contact area
    • 150µ" Tin (Sn) minimum in the solder tail area
    • 50µ" Nickel (Ni) minimum underplating

Videos

Additional Resources

Related Connectors

Molex EXTreme Power Connectors

Specifically designed to support high-current applications for peak efficiency.

Learn More關於Molex EXTreme Power Connectors View Products與Molex EXTreme Power Connectors相關
發佈日期: 2017-06-14 | 更新日期: 2025-11-25