ADLINK Technology Thermal Solutions for Express-BD7 COMs
ADLINK Technology Thermal Solutions for Express-BD7 COMs extend the lifespan of computer-on-modules by dissipating heat. These thermal solutions include heat spreaders, which conduct heat to other system cooling components, passive heatsinks, which dissipate heat using cooling fins, and active heatsinks, which include a cooling fan. These ADLINK thermal solutions are specifically designed for the Express-BD7 Modules, ensuring a custom fit and preventing mechanical stress.
Features
- Extends the lifespan of Computer-on-Modules by dissipating heat
- Includes heat spreaders, passive heatsinks, and active heatsinks
- Specifically designed for the Express-BD7 Modules
Associated Products
ADLINK Technology Express-BD7 Computer-on-Modules
COM Express Basic Size Type 7 Module with Up to 16 cores Intel Xeon D and Pentium D SoC.
ADLINK Technology COM Express Type 7 Starter Kit Plus
Includes everything needed to design and develop COM Express systems based on Type 7 Modules.
ADLINK Technology Express-BASE7
COM Express® Type 7 Reference Carrier Board in a standard ATX Form Factor.
ADLINK Technology SFP+ Card
COM Express Type 7 10GbE Optical Fiber Network Adapter supporting up to four SFP+ interfaces.
View Results ( 4 ) Page
| 零件編號 | 說明 |
|---|---|
| HTS-BD7-B | 散熱器 Heatspreader for Express-BD7 with threaded standoffs for bottom mounting |
| THS-BD7-BTL | 散熱器 THS-BD7-BTLLow profile heatsink for Express-BD7 with through hole standoffs for top mounting |
| THSF-BD7-BL | 散熱器 THSF-BD7-BLHigh profile heatsink with Fan for Express-BD7 with threaded standoffs for bottom mounting |
| THS-BD7-BL | 散熱器 THS-BD7-BLLow profile heatsink for Express-BD7 with threaded standoffs for bottom mounting |
發佈日期: 2018-05-03
| 更新日期: 2022-07-18