Infineon Technologies Prime Block Modules
Infineon Technologies Prime Block Modules are 20mm, 34mm, 50mm, and 60mm bipolar modules in solder bond technology. The modules are cost-optimized alternatives to Infineon's pressure contact module technology even in demanding applications. Solder bond modules are ideal for applications where the highest robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, and soft starters.
Features
- Increased power density
- Predictably high performance and lifetime due to 100% x-ray monitoring
- Solid base plate for fast and easy mounting
- Optimized thermal design
- Best-in-class power density in 50mm and 60mm housing
- 50mm footprint available with TIM
Applications
- Drives
- Soft starters
- Power supplies
- Welding
- Static switches
- Battery chargers
發佈日期: 2018-11-13
| 更新日期: 2022-09-02