Laird Technologies
Laird Performance Materials設計並開發電子裝置保護解決方案，包括EMI抑制、熱管理材料、結構和精密金屬及多功能產品。材料科學專家能提供更好保護、更高效能和可靠性、自訂結構設計並縮短上市時間。
特色產品分組依據： Laird Technologies
Tflex™ SF16 Thermal Gap Fillers
Innovative, high-performing thermal materials in the Laird non-silicone-based gap filler portfolio.
MAF06 High-Current Low DCR SMD Power Inductors
Power line noise suppression and desired power efficiency while delivering extremely low DCR.
Tflex™ HR6.5 Thermal Gap Filler
Thermal interface material with >6W/mK thermal conductivity with high recovery properties.
Tflex™ CR550 2-Part Dispensable Gap Filler
Transfers unwanted heat in automotive components and the A+B putty material cures in place.