Microchip Technology 碳化矽 (SiC) 功率模組
Microchip Technology碳化矽 (SiC) 功率模組將一系列強大技術整合到單一封裝內，針對可靠性、效率和空間效益最佳化，還能縮短組裝時間。隨時可出貨的標準模組產品系列涵蓋電路拓撲、包括碳化矽在內的半導體、電壓和電流額定值以及封裝等多樣品項。應用專屬的功率模組 (ASPM®) 可滿足獨特要求。
特點
- 寬溫度範圍：-60°C至+200°C
- 高可靠性
- 尺寸更小、重量更輕
- 高可靠性的測試與篩選選項
應用
- 焊接
- 太陽能
- 感應加熱
- 醫療
- UPS
- 馬達控制
- 交換式電源供應器
- 國防與航太
資源
- 48kW Resonant Converter for X-ray Machines Uses High-Speed Power Modules with Integral Liquid Cooling
- Advanced IGBT Driver Application Manual
- Baseplate Flatness of Power Modules
- Handling Instructions and Protection against Electrostatic Discharges
- High-Frequency Resonant Half Bridge
- Mounting Instructions for D3 and D4 Power Modules
- Mounting Instructions for SP1 Power Modules
- Mounting Instructions for Phase Leg and Full Bridge SP2 Power Modules
- Mounting Instructions for SP3 Power Modules
- Mounting Instructions for SP3F Power Modules
- Mounting Instructions for SP4 Power Modules
- Mounting Instructions for SP6 Power Modules
- Mounting Instructions for SP6 Low Inductance Power Module
- Mounting Instruction for SP6P Power Module
- Parallel Connection of IGBT and MOSFET Power Modules
- Turn-Off Snubber Design for High-Frequency Modules
- Using NTC Temperature Sensors Integrated into Power Modules
相關產品
Microchip Technology Silicon Carbide (SiC) Semiconductors
Offers a small footprint, high thermal conductivity, and zero reverse recovery charge.
Microchip Technology 碳化矽(SiC) MOSFET
與傳統的矽(Si)功率MOSFET相比，具有良好的動態及熱性能。
Microchip Technology 碳化矽(SiC)肖特基能障二極體
零正向及反向恢復電荷提高系統效率。
發佈日期: 2020-01-29
| 更新日期: 2024-07-08