Molex Vertical SMT Modular Jacks w/ Polyimide Film
Molex Vertical SMT Modular Jacks with Polyimide film for vacuum pick-and-place functionality can streamline high-volume PCB production and lower manufacturing costs. Automatic vacuum pick-and-place is the most common high-speed manufacturing process for precision placement of surface mount components on PCBs in mass production. The addition of Polyimide film to the surface of Molex Vertical SMT Modular Jacks facilitates automatic vacuum pick-and-place of the connector alongside other SMT components. This streamlines high-volume production and lowers manufacturing costs for customers. These Molex modular jacks are ideal for use in a variety of networking, commercial, consumer office, medical, and industrial applications.Features
- Low-profile versions (series 85513) available
- Allows for tight board stacking
- RJ-11 and RJ-45 jacks available
- Provides flexibility for variety of design applications
- 50μ" Gold plating options
- Meets FCC68.5, IEC60603-7 and is approved for all FCC and IEC licenses applications
- Palladium nickel (PdNi) + gold (Au) flash plating option
- Achieves 2500 mating cycles
- Meets the new durability requirement of IEC60603-7 PL 2 and FCC68.5 standards
Specifications
- Electrical
- 125VDC voltage rating
- 1.5A current rating
- 20mΩ max. contact resistance
- 1000Vrms dielectric withstanding voltage
- 500MΩ min. insulation resistance
- Mechanical
- 20mΩ max. contact retention to housing
- 20N max. insertion force to PCB
- 20N max. mating force
- 20N max. unmating force
- 5000 (min.) operations of durability
Applications
- Networking
- Servers
- Switches
- Routers
- Commercial
- Vending machines
- Cash registers
- Card swipes
- Consumer
- Set top boxes
- Home security
- Web TV
- Gaming devices
- Office
- Printers
- Photocopiers
- Desktops and laptops
- Medical
- Home analysis monitors
- Bed monitors
- Breathing devices
- Industrial
- Control units
- Vision systems
- Security systems
- Test equipment
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發佈日期: 2014-05-08
| 更新日期: 2022-03-11
