Nexperia 1200V SiC MOSFETs
Nexperia 1200V SiC MOSFETs are housed in QDPAK (top-side cooled) packaging and are designed for automotive and industrial power conversion systems requiring high efficiency, high power density, and robust thermal performance. These devices combine SiC switching performance with a top-side cooled package architecture, providing a direct die-to-heatsink thermal path. This reduces dependence on PCB heat spreading and supports simpler, more effective cooling concepts in compact designs. Typical applications include EV onboard chargers, DC-DC converters, traction and auxiliary inverters, EV charging infrastructure, renewable energy systems, and high-power AC-DC/DC-DC conversion.
Features
- Low-inductance package design supporting controlled high-speed switching
- Fast switching performance with low switching losses
- Stable RDS(on) over temperature
- Robust body diode with fast recovery characteristics
- Kelvin source connection for improved switching behavior
- Low-profile package suitable for height-constrained designs
- Surface-mount package compatible with automated assembly
- Simplified thermal design through direct heat transfer to the heatsink
- Reduced cooling complexity and system cost
- Consistent efficiency across the temperature range due to stable RDS(on)
- Clean switching behavior with reduced ringing and EMI
- Compact system implementation in space- and height-constrained designs
- Design scalability across multiple RDS(on) options and qualification levels
Applications
- Automotive power systems (on-board chargers, DC-DC converters, and traction and auxiliary inverters)
- EV charging infrastructure (AC/DC and DC fast charging)
- Photovoltaic (PV) inverters
- Energy Storage Systems (ESS/BESS)
- Industrial motor drives and servo drives
- Switch-Mode Power Supplies (SMPS)
- Uninterruptible Power Supplies (UPS)
- High-power AC-DC and DC-DC converters (including data center power systems)
Quick reference
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