Quectel FC21 Module
Quectel FC21 Module is a cost-effective, high-performance Wi-Fi® and BLUETOOTH® module with an ultra-compact LCC package. This module uses Surface-Mount Technology (SMT), an ideal solution for durable, rugged designs. The FC21 module features advanced packaging that enables large-scale automated manufacturing while meeting strict cost and efficiency requirements. This module offers advantages such as low power consumption, extended temperature range, and a stable SDIO interface. The FC21 module is typically used in combination with LTE Standard EC21, EC25, EC20-CE, and EG25-G series modules. This module is also used with other application processors, including IMX6 and IMX8, to serve a wide range of M2M applications. Typical applications include automotive, smart safety, industrial PDA, MiFi, and health care.
Features
- Ultra-compact Wi-Fi® and Bluetooth® module
- BLE (Bluetooth 5.0) support
- IEEE802.11 a/b/g/n/ac standards support
- Simple design minimizes design-in time and development efforts, enabling fast time-to-market
- Easier soldering and testing process with the LCC package
- Stable and reliable SDIO communication interface
- Low power consumption and extended temperature range
- Surface-Mount Technology (SMT)
Applications
- Automotive
- Smart safety
- Industrial PDA
- MiFi
- Health care
Specifications
- BPSK, QPSK, CCK, 16QAM, 64QAM, and 256QAM modulation mode
- WPA3 encryption mode
- 16 maximum Access Points (AP)
- AP/STA operating mode
- Interfaces:
- 1 x SDIO 3.0
- 1 x BT_UART
- 1 x PCM
- 1x Wi-Fi/Bluetooth antenna
- Power supply voltage range:
- 3.14V to 3.46V
- 3.3V typical
- I/O power supply voltage range:
- 1.71V to 3.46V
- 1.8V/3.3V typical
- -40°C to +85°C operating temperature range
- 16.6mm x 13mm x 2.05mm dimensions
- 0.73g approximate weight