TDK 軟終端C系列MLCC
TDK新的軟終端C系列多層晶片電容器於製造或最後組裝時提供改良的抗彎曲效能（電路板抗彎性）。易碎的陶瓷材料使用在標準終端電容器上，易於在焊接時受損，TDK的軟終端電容器有導電電層吸收及外來壓力保護陶瓷機身。這些軟終端電容器同時在使用無鉛焊接時提供對易碎焊腳的保護。 TDK的軟終端C系列MLCC的其他特點及優點包括改善的溫度週期效能及符合RoHS、WEE及REACH規定。軟終端電容器適合大部分TDK MLCC產品線，高達C3225的外盒尺寸，並包括2合1電容陣列電線。
特點
- Improved bending resistance (board flex resistance)
- Improved temperature cycle performance
- Conductive resin absorbs external stress to protect solder joint parts and capacitor body
- Available in TDK Automotive Grade (CGA) series
- Available in higher capacitance (up to 10μF) and voltage ranges (16V to 1kV)
- RoHS, WEE, and REACH compliant
應用
- Electronic circuits mounted on alumina substrate
- SMT applications that require bending robustness
- Lead-free solder applications in which solder joint reliability is problematic
- Solar micro-inverters
- Switching power supplies
- LED lighting
- Smart meters
- Telecom base stations
影片
Dimensions
發佈日期: 2011-07-26
| 更新日期: 2024-10-22