Texas Instruments SimpleLink™ CC3301 BoosterPack™ Plug-in Module
Texas Instruments SimpleLink™ CC3301 BoosterPack™ Plug-in Module is a Wi-Fi® 6 and BLUETOOTH® Low Energy test and development board. This module can be easily connected to TI LaunchPad™ development kits or processor boards for rapid software development. The evaluation board features 2x20 pin stackable connectors (BoosterPack plug-in module headers) to connect to the LaunchPad kits and other BoosterPack plug-in modules. TI SimpleLink CC3301 BoosterPack Plug-in Module can be used in three configurations and can be wired to any other Linux or RTOS host board running TCP/IP stack. This CC3301 BoosterPack companion IC is offered in a QFN package.
Features
- CC3301 Wi-Fi 6 and Bluetooth Low Energy companion IC
- QFN package
- Can be used in 3 configurations
- MCU and RTOS evaluation: BP-CC3301 + LaunchPad with the MCU running TCP/IP like the LP-AM243
- Processor and Linux evaluation: BP-CC3301 + BP-CC33-BBB-ADAPT + BEAGL-BONE-BLACK
- RF testing with PC tools: BP-CC3301 + LP-XDS110
- Can be wired to any other Linux or RTOS host board running TCP/IP stack
- 2x20 pin stackable connectors (BoosterPack plug-in module headers) to connect to TI LaunchPad development kits and other BoosterPack plug-in modules
- Onboard chip antenna with option for SMA/U.FL based testing
- SWD interface for standalone operation and RF testing
Related Products
Texas Instruments CC3300和CC3301 SimpleLink™收發器
提供具備0.4 mm間距的40腳位、5 mm x 5 mm QFN封裝的高整合度單晶片WLAN和BLUETOOTH®低功耗裝置。
發佈日期: 2023-04-20
| 更新日期: 2024-09-04