特點
- High voltage up to 3000V
- <0.5% stability
- Flow solderable
- Internationally standardized sizes
- Available with wrap-around termination or as a single-termination flip chip
- Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold, or solder-coated nickel barrier terminations
- Wide range of options offer design flexibility
- Non-magnetic terminations available
- Automatic placement capability
應用
- Solderable
- Epoxy bondable
- Wire bondable
Infographic
發佈日期: 2011-06-23
| 更新日期: 2022-07-25

