Panasonic Electronic Components PAN1326系列藍芽模組
Panasonic Electronic ComponentsPAN1326主機控制接口(HCI)藍芽低耗能雙模式模組是Texas Instrument第7代藍芽核心集成電路CC2564,採用容易使用的模組格式。PAN1326系列HCI藍芽模組採用Panasonic小腳位技術,它安裝在85.5mm²的設備內, 以切合1.3mm的PCB墊間距,並只有兩層之小,使之容易實現及製造。PAN1326模組的設計100%與上一代PAN1325相容。PAN1326系列模組的獨特設計特點有助于透過數據鍊在藍芽經典與藍芽低耗能之間實現無縫切換。PAN1326系列模組採用1.7-4.8V電源電壓範圍、-20ºC至+70ºC操作溫度範圍、ACL及eSCO的超快演算法等等。PAN1326系列模組連接移動設備,如:手提電話及小按鈕電池供電設備,當中包括:健康傳感器、手錶及保健配件。Panasonic's New PAN1326B / PAN1316B Bluetooth modules now support ten simultaneous BLE connections, up from six.
特點
- Communicates with BT Low Energy single mode devices
- Best-in-class Bluetooth RF performance (Tx, Rx sensitivity, blocking)
- Fully qualified Bluetooth v4.0 EDR, FCC and IC listed, CE complied
- Dimensions: 9.0 x 9.5 x 1.8mm (W x L x H)
- Profiles: SPP, HDP, Audio and others can run on the host processor (Integrates with TI's ultra low-power MSP430 microprocessor)
- Supports Extended Range Tx power with 10.5dBm typical output
- Low power scan method and inquiry scans at 1/3 normal power
- Interfaces
- 3.25Mbaud UART with transport layer detection
- PCM/I2S interface for digital audio
PAN1326/1316 Series Bluetooth® High Temperature Modules
ENW-89823C3KF PAN1316, CC2564, Bluetooth & Bluetooth Low Energy, HCI module
ENW89823A3KF PAN1326B, CC2564B, Bluetooth & Bluetooth Low Energy, HCI module
