STMicroelectronics Teseo-VIC3D Industrial GNSS Dead-Reckoning Module
STMicroelectronics Teseo-VIC3D Industrial GNSS Dead-Reckoning Module embeds the TeseoIII single die standalone positioning receiver IC working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS).
The STM Teseo-VIC3D Module utilizes the proven accuracy and robustness of the TeseoIII chip, while the embedded firmware and the complete evaluation environment save development time. The Teseo-VIC3D offers superior accuracy within a 16.0mm x 12.2mm size via the onboard Temperature Compensated Crystal Oscillator (TCXO) and a reduced Time To First Fix (TTFF) relying on its dedicated Real-Time Clock (RTC) oscillator. The embedded flash enables many extra features such as seven days Autonomous Assisted GNSS and Real-Time Assisted GNSS.
The Teseo-VIC3D supports FW configurability as well as FW upgrades. As a certified solution, the Teseo-VIC3D module optimizes the time to market final applications and has a temperature operating range from -40°C to +85°C.
Features
- Simultaneous multi constellation
- Teseo dead-reckoning Automotive way firmware
- -163dBm sensitivity tracking
- 1.5m CEP accuracy positioning
- Embedded Flash for FW upgrade
- GNSS and 6-axis inertial sensor
- 3.3V supply voltage
- LCC 24 pins package (16.0mm x 12.2mm x 2.42mm)
- Operating temperature (from -40°C to +85°C)
- Free FW configuration
- 17μA standby current
Associated Products
STMicroelectronics TESEO-VIC3DA Automotive GNSS Dead-Reckoning Module
Embeds the TeseoIII single die standalone positioning receiver IC in a 16.0mm x 12.2mm size.
Associated Eval Platform
STMicroelectronics EVB-VIC3DA Evaluation Platform
Intended for the Teseo-VIC3DA GNSS dead-reckoning module ST solution.
Additional Resources
Block Diagram
Pin Layout
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