所有結果 (665)

電腦模組 - COM COM HPC Size A module with Intel Core i5-1145G7E Processor, quad core with 2.6GHz (up to 4.1GHz), 8MB L2 cache, GT80 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP).

電腦模組 - COM COM HPC Size A module with Intel Celeron 6305E Processor, dual core with 1.8GHz, 4MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (15W TDP).

CPU和晶片散熱器 Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

CPU和晶片散熱器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with M2.5mm thread.

電腦模組 - COM COM Express Type 6 Basic module based on Intel Core i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset

電腦模組 - COM COM Express Type 6 Basic module based on Intel Core i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset

電腦模組 - COM COM Express Type 6 Basic module based on Intel Xeon Processor W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) wi

電腦模組 - COM COM Express Type 6 Basic module based on Intel Xeon Processor W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) wit

電腦模組 - COM COM Express Type 6 Basic module based on Intel Xeon Processor W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) wi

CPU和晶片散熱器 Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

CPU和晶片散熱器 Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are with 2.7mm bore hole.

散熱器 Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.