結果: 91
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS
Nordic Semiconductor RF系統單晶片 - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, CSP 無庫存前置作業時間 20 週
NT$59.15
NT$57.36
NT$56.28
最少: 1,500
倍數: 1
Nordic Semiconductor RF系統單晶片 - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, QFN 無庫存前置作業時間 20 週
NT$64.89
NT$63.81
最少: 3,000
倍數: 1
Nordic Semiconductor RF系統單晶片 - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, QFN 無庫存前置作業時間 20 週
NT$67.04
NT$64.89
NT$63.81
最少: 1,000
倍數: 1
Fanstel BM05M
Fanstel 藍牙模組 - 802.15.1 Mini nRF54L05 BLE 6.0 module, 500KB flash, 96 KB RAM, PCB antenna 無庫存前置作業時間 10 週
帶狀裁切
NT$212.23
NT$183.91
NT$171.36
NT$160.61
NT$139.82
最少: 1
倍數: 1
: 1,000
Nordic Semiconductor NRF54LC10A-QFAA-R7
Nordic Semiconductor RF系統單晶片 - SoC Entry-level, ultra-low-power wireless SoC for Bluetooth LE, Matter, Thread, and Zigbee 無庫存前置作業時間 20 週
NT$67.04
NT$64.89
NT$63.81
最少: 1,000
倍數: 1
Silex Technology 多通訊協定模組 Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6 無庫存前置作業時間 34 週
NT$983.37
最少: 500
倍數: 500
: 500
Silex Technology 多通訊協定模組 IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy 無庫存前置作業時間 34 週
NT$1,332.54
NT$1,220.69
NT$1,118.88
NT$1,037.50
最少: 1
倍數: 1
Silex Technology 多通訊協定模組 the option to attach an antenna via a trace. does not include the u.Fl connector 無庫存前置作業時間 34 週
NT$983.37
最少: 500
倍數: 500
: 500
Silex Technology 多通訊協定模組 the option to attach an antenna via a trace does not include the u.Fl connector 無庫存前置作業時間 34 週
NT$1,332.54
NT$1,220.69
NT$1,118.88
NT$1,037.50
最少: 1
倍數: 1
Quectel 藍牙模組 - 802.15.1 BT6.0, 1st generation RF coaxial connector*2,256KB SRAM,1MB internal flash,Tx power 10dBm,-40? +105? 無庫存前置作業時間 18 週
NT$243.06
NT$230.52
最少: 500
倍數: 500
: 500
Quectel 多通訊協定模組 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB 無庫存前置作業時間 16 週
NT$226.93
NT$222.99
最少: 500
倍數: 500
: 500
Quectel 多通訊協定模組 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax 無庫存前置作業時間 16 週
NT$228.36
NT$224.42
最少: 500
倍數: 500
: 500
Quectel 多通訊協定模組 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB 無庫存前置作業時間 16 週
NT$265.65
最少: 1,000
倍數: 1,000
: 1,000
Quectel 多通訊協定模組 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax 無庫存前置作業時間 16 週
NT$270.67
最少: 1,000
倍數: 1,000
: 1,000
Quectel 多通訊協定模組 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm 無庫存前置作業時間 18 週
NT$480.75
最少: 500
倍數: 500
: 500
Quectel 多通訊協定模組 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm 無庫存前置作業時間 18 週
NT$563.56
最少: 500
倍數: 500
: 500