It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

Return to Search Results

See an Error?

ATS-59003-C1-R0

Name: Advanced Thermal Solutions ATS-59003-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-59003-C1-R0
Price: 823.83 TWD
Availability: OutOfStock

Images are for reference only
See Product Specifications

Mouser #:

984-ATS-59003-C1-R0

Mfr. #:

ATS-59003-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 25mm Comp, 32x50x12mm

Datasheet:

ATS-59003-C1-R0 Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

More Information

Learn more about Advanced Thermal Solutions ATS-59003-C1-R0

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	BGA
Mounting Style:	Snap On
Heatsink Material:	Aluminum
Fin Style:	maxiFLOW
Thermal Resistance:	3.8 C/W
Length:	50 mm
Width:	32 mm
Height:	12 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	maxiGRIP HS ASM - Custom
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW maxiGRIP
Type:	Component

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

ATS-59003-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

This functionality requires JavaScript to be enabled.

Compliance Codes

USHTS:: 7616995190
TARIC:: 7616991099
MXHTS:: 7616995195
ECCN:: EAR99

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.