UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays

Samtec UDx6 AcceleRate® mP 0.635mm Signal/Power Arrays are 0.635mm pitch high-density, high-speed signal/power arrays that achieve 64Gbps PAM4 speeds. These Samtech signal/power arrays feature rotated power blades for improved performance and simplified breakout region (BOR). These UDx6 AcceleRate MP series features 5mm and 10mm stack heights and up to 10 power and 240 signal positions. The signal/power arrays offer an open-pin-field design for routing and grounding flexibility. The series includes optional alignment pins, standard weld tabs for a secure connection to the board, and polarized guide posts for blind mating.

結果: 40
選擇 圖像 零件編號
 製造商
說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。
數量 RoHS ECAD模型 產品
定位數
間距
排數
終端類型
裝配角
额定电流
額定電壓
最高數據率
最低工作溫度
最高工作溫度
觸點电镀
觸點材料
外殼材料
系列
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 3 週
最少： 375
倍數： 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 3 週
最少： 200
倍數： 1

Connectors 40 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 3 週
最少： 375
倍數： 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 3 週
最少： 200
倍數： 1

Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 3 週
最少： 200
倍數： 1

Connectors 100 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 3 週
最少： 375
倍數： 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 3 週
最少： 375
倍數： 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 10 週
最少： 200
倍數： 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 3 週
最少： 375
倍數： 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 3 週
最少： 200
倍數： 1

Connectors 120 Position 0.635 mm (0.025 in) 4 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 3 週
最少： 375
倍數： 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 3 週
最少： 200
倍數： 1

Connectors 150 Position 0.635 mm (0.025 in) 5 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket
規格書
無庫存前置作業時間 14 週
最少： 350
倍數： 1

Connectors 90 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDF6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 13 週
最少： 200
倍數： 1

Connectors 60 Position 0.635 mm (0.025 in) 3 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6
Samtec 板對板及夾層連接器 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal
規格書
無庫存前置作業時間 14 週
最少： 200
倍數： 1

Connectors 60 Position 0.635 mm (0.025 in) 2 Row Solder Vertical 15 A 200 VAC, 283 VDC 64 Gb/s - 55 C + 125 C Gold Copper Liquid Crystal Polymer (LCP) UDM6