AI7933CLD

Name: AcSiP AI7933CLD
Brand: AcSiP
SKU: 99-AI7933CLD
Price: 537.75 TWD
Availability: InStock

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Mouser #:

99-AI7933CLD

Mfr. #:

AI7933CLD

Mfr.:

AcSiP

Description:

Multiprotocol Modules AI7933CLD - Multiprotocol Modules WIFI6+DSP Dual Band 2.4/5GHz M33 SoC Module

Datasheet:

AI7933CLD Datasheet (PDF)

ECAD Model:

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More Information

Learn more about AcSiP AI7933CLD

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	AcSiP
Product Category:	Multiprotocol Modules
RoHS:
Series:	WIFI
Frequency:	300 MHz
Interface Type:	ADC, GPIO, I2C, I2S, IR, PWM, SDIO, SPI, UART
Supply Voltage - Min:	2.97 V
Supply Voltage - Max:	3.63 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Dimensions:	32 mm x 32 mm x 2.7 mm
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth 5.2
Protocol - WiFi - 802.11:	802.11 a/b/g/n/ac/ax
Packaging:	Bag
Brand:	AcSiP
Core:	ARM Cortex M33
Memory Size:	16 MB
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Number of Channels:	13 Channel
Operating Supply Voltage:	2.97 V to 3.63 V
Product Type:	Multiprotocol Modules
Factory Pack Quantity:	2
Subcategory:	Wireless & RF Modules
Supply Current Receiving:	37 mA, 58 mA
Supply Current Transmitting:	328 mA

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Datasheet

AI7933CLD Datasheet (PDF)

Compliance Codes

USHTS:: 8517620090
JPHTS:: 851762090
TARIC:: 8517620000
ECCN:: EAR99

Origin Classifications

Country of Origin:: Taiwan, China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

AI7933CLD Internet of Things (IoT) Module

AcSiP AI7933CLD Internet of Things (IoT) Module is based on Arm^® Cortex-M33 with a floating point microcontroller including SRAM/ROM memory. This module supports rich peripheral interfaces such as SPI, SDIO, I²C, I²S, IR input, UART, and GPIOs. The AI7933CLD IoT module includes an 802.11 a/b/g/n/ac/ax dual-band Wi-Fi^® subsystem, a Bluetooth^® v5.2 subsystem, and a Power Management Unit (PMU). This module is ideal for IoT devices with smart connections and cloud applications.