|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-2-K-TR
- Samtec
-
450:
NT$527.35
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40015L042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
最少: 450
倍數: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-1-K-TR
- Samtec
-
300:
NT$807.70
-
無庫存前置作業時間 2 週
|
Mouser 元件編號
200-LPAM40015L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 2 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-1-K-TR
- Samtec
-
450:
NT$577.90
-
無庫存前置作業時間 9 週
|
Mouser 元件編號
200-LPAM40015S041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 9 週
|
|
最少: 450
倍數: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-2-K-TR
- Samtec
-
450:
NT$577.90
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40015S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
最少: 450
倍數: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-S-08-2-K-TR
- Samtec
-
300:
NT$1,160.46
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM50015S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-50-03.0-L-08-1-K-TR
- Samtec
-
350:
NT$871.16
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAF50030L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 350
倍數: 350
:
350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAF
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-08-2-K-TR
- Samtec
-
1:
NT$535.96
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM10010L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 1
倍數: 1
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-04-2-K-TR
- Samtec
-
625:
NT$265.65
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM10010S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 625
倍數: 625
:
625
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-1-K-TR
- Samtec
-
575:
NT$245.57
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM10015L041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 575
倍數: 575
:
575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-06-1-K-TR
- Samtec
-
375:
NT$335.20
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM10015L061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 375
倍數: 375
:
375
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-04-2-K-TR
- Samtec
-
475:
NT$364.24
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM20010S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 475
倍數: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-06-2-K-TR
- Samtec
-
325:
NT$439.88
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM20010S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 325
倍數: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-2-K-TR
- Samtec
-
300:
NT$578.26
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM20010S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-1-K-TR
- Samtec
-
325:
NT$478.24
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM30010L061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 325
倍數: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-08-1-K-TR
- Samtec
-
325:
NT$618.77
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM30010L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 325
倍數: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-04-2-K-TR
- Samtec
-
475:
NT$433.07
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM30010S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 475
倍數: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-08-1-K-TR
- Samtec
-
1:
NT$899.12
-
無庫存前置作業時間 13 週
|
Mouser 元件編號
200-LPAM30015L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 13 週
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-08-1-K-TR
- Samtec
-
300:
NT$778.30
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM40010L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-08-1-K-TR
- Samtec
-
300:
NT$877.61
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM40010S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-1-K-TR
- Samtec
-
450:
NT$527.35
-
無庫存前置作業時間 13 週
|
Mouser 元件編號
200-LPAM40015L041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 13 週
|
|
最少: 450
倍數: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-1-K-TR
- Samtec
-
300:
NT$1,025.67
-
無庫存前置作業時間 13 週
|
Mouser 元件編號
200-LPAM50010S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 13 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-2-K-TR
- Samtec
-
300:
NT$1,047.54
-
無庫存前置作業時間 14 週
|
Mouser 元件編號
200-LPAM50010S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 14 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-L-04-1-K-TR
- Samtec
-
650:
NT$309.74
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAF1003.5L041K
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
最少: 650
倍數: 650
:
650
|
否
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-L-08-1-K-TR
- Samtec
-
350:
NT$481.11
-
無庫存前置作業時間 3 週
|
Mouser 元件編號
200-LPAF2003.0L081K
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 3 週
|
|
最少: 350
倍數: 350
:
350
|
否
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-04-1-K-TR
- Samtec
-
550:
NT$414.43
-
無庫存前置作業時間 6 週
|
Mouser 元件編號
200-LPAF4003.0L041K
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 6 週
|
|
最少: 550
倍數: 550
:
550
|
否
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|