FGA66XABMD

Name: Quectel FGA66XABMD
Brand: Quectel
SKU: 277-FGA66XABMD
Price: 514.45 TWD
Availability: OutOfStock

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請參閱產品規格

Mouser 編號：

277-FGA66XABMD

製造商編號：

FGA66XABMD

製造商：

Quectel

說明：

多通訊協定模組 Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C

壽命週期:

新產品:

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規格書:

FGA66XABMD 規格書

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商品屬性	屬性值	選擇屬性
製造商:	Quectel
產品類型:	多通訊協定模組
頻率:	2.4 GHz, 5 GHz
接口類型:	SPI, UART, USB
電源電壓 - 最小值:	3.14 V
電源電壓 - 最大值:	3.46 V
最低工作溫度:	- 40 C
最高工作溫度:	+ 85 C
天線連接器類型:	PCB Antenna
尺寸:	23 mm x 14 mm x 2.2 mm
協議 - 藍牙、BLE (802.15.1):	BLE 5.4
協議 - WiFi (802.11):	802.11 a/b/g/n/ac/ax
封裝:	Reel
封裝:	Cut Tape
品牌:	Quectel
數據率:	114.7 Mb/s
調製技術:	DSSS/ OFDM/ DBPSK/ DQPSK/ CCK/ BPSK/ QPSK/ 16QAM/ 64QAM/ 256QAM
安裝風格:	SMD/SMT
工作電源電壓:	3.3 V
產品類型:	Multiprotocol Modules
原廠包裝數量:	500
子類別:	Wireless & RF Modules
類型:	Wi-Fi 6, BLE 5.4

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篩選文檔:

規格書

FGA66XABMD 規格書

合規守則

USHTS:: 8517620090
JPHTS:: 851762090
TARIC:: 8517620000
ECCN:: 5A992.C

原產地分類

原產國:: 中國
封裝原產國:: 無資料
擴散國:: 無資料

出貨時，國家可能會有所變更。

FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 Modules

Quectel FGA66X Wi-Fi^® 6, BLE 5.4, and IEEE 802.15.4 Modules are high-performance modules in an LGA package and support the IEEE 802.11ax standard protocol. These modules operate at MCS 0 to MCS 9 rates over a 20MHz bandwidth and 256QAM. The FGA66X modules are designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability. The low profile and small size of the LGA package enable the modules to be easily embedded in size-constrained applications and to provide reliable connectivity. The FGA66X modules are available in an ultra-compact size of 23mm x 14mm x 2.2mm to meet the demands of size-sensitive applications. These modules operate over a wide temperature range of -40°C to +85°C. The FGA66X modules are ideal for a variety of smart home and industrial applications.

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QUECTEL

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FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 Modules

High-performance module in an LGA package and supports the IEEE 802.11ax standard protocol.

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FGD966X Wi-Fi 6, BLE 5.4, & 802.15.4 Module

High-performance module in an LGA package with an ultra-compact 12mm x 12mm x 2mm size.

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FCM363X Wi-Fi 6 & BLE 5.3 Module

Cutting-edge MCU Wi-Fi and BLUETOOTH® module.

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供貨情況

庫存：: 0

您仍可購買此商品作為延期交貨訂單。

發生意外錯誤了。請稍後再試。
在途量:: 38
工廠前置作業時間：: 32

週工廠預計生產時間數量大於所顯示的數量。

此產品已報告長備貨期。

輸入數量：

最少： 1 多個： 1

單價:

NT$-.--

總價:

NT$-.--

估計關稅:

Pricing (TWD)

數量	單價	總價
	NT$514.45	NT$514.45
	NT$447.41	NT$4,474.10
	NT$424.46	NT$10,611.50
	NT$392.56	NT$39,256.00
	NT$373.56	NT$93,390.00
完整捲（訂購多個500）
	NT$359.93	NT$179,965.00

FGA66XABMD

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製造商： Quectel

說明： 多通訊協定模組 Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C

規格

文件 (1)

規格書

產品與貿易合規

更多資訊

FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 Modules

特色產品 QUECTEL

供貨情況

Pricing (TWD)

產品速覽

發生了意外錯誤。

製造商：

Quectel

說明：

多通訊協定模組 Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C

特色產品

QUECTEL