-ar 多協議模組

結果: 240
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - Sub GHz 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 封裝
Quectel 多協議模組 Embedded, 1710-2700, 3300-5000, 5G, FPC with holder, -, Spring contact, Screw, 37.25 9.6 10.1 1庫存量
最少: 1
倍數: 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Quectel 多協議模組 Embedded, 2400-2500 MHz, 4900-5850 MHz,5925-7125MHz, Wi-Fi (Bluetooth), PFC with cable, 100 +/-2 mm, IPEX ?(U.FL Generation ?), Adhesive, 28.9x11x0.2 31庫存量
68預期2026/8/24
最少: 1
倍數: 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Embedded Artists 多協議模組 2EL M.2 Wi-Fi 6 a/b/g/n/ac/ax, Bluetooth 5.3 with IW612 chipset and LBES5PL2EL
323預期2027/2/26
最少: 1
倍數: 1

2.4 GHz to 2.484 GHz 2.6 dBm SPI - 40 C + 85 C 802.11 a/b/g/n/ac/ax Bulk
Nordic Semiconductor 多協議模組 Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2,500預期2026/12/25
最少: 1
倍數: 1
: 2,500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape
Embedded Artists 多協議模組 1YN M.2 Wi-Fi 4 b/g/n, Bluetooth 5.2 with CYW43439 chipset and LBEE5KL1YN
750預期2026/12/1
最少: 1
倍數: 1

2.4 GHz 4-Wire UART, SDIO 3 V 3.5 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n Bulk
Quectel 多協議模組 Cat M1/Cat NB2, Power Class 5, 450 MHz Supported + GNSS (w/o WWAN concurrency) 31庫存量
最少: 1
倍數: 1
: 250

26 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel 多協議模組 Cat M1/Cat NB2, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency) 28庫存量
1,000預期2026/9/1
最少: 1
倍數: 1
: 250

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape, MouseReel
CEL 多協議模組 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3庫存量
最少: 1
倍數: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Embedded Artists 多協議模組 2FY M.2 Module
49在途量
最少: 1
倍數: 1

2.4 GHz to 2.484 GHz 9 dBm Audio, SDIO, UART 3.15 V 3.46 V - 40 C + 85 C U.FL Bluetooth 5.0 802.11a/b/g/n/ac/ax, 6/6E Bulk
Embedded Artists 多協議模組 2GF M.2 Module
45預期2026/10/30
最少: 1
倍數: 1

2.4 GHz to 5 GHz 4-Wire UART, SDIO 3.15 V 3.46 V - 20 C + 70 C u.FL 802.11 a/b/g/n/ac Bulk
Ezurio 多協議模組 Module, BL54L15, Bluetooth LE, Chip Antenna, Cut Tape
1,544預期2026/12/2
最少: 1
倍數: 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio 多協議模組 Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
1,000預期2026/12/31
最少: 1
倍數: 1
: 1,000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Silicon Labs 多協議模組 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, Integrated Antenna, 32KHz XTAL Pins, MVP 200庫存量
最少: 1
倍數: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Kaga FEI 多協議模組 WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
300預期2026/11/17
最少: 1
倍數: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Silicon Labs 多協議模組 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, Integrated Antenna, 32KHz XTAL Pins, MVP
200預期2026/8/20
最少: 1
倍數: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Ezurio 多協議模組 Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Cut Tape
250預期2026/9/2
最少: 1
倍數: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio 多協議模組 Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape
220預期2026/9/2
最少: 1
倍數: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Texas Instruments 多協議模組 SimpleLink multipro tocol 2.4-GHz wirele
1,900預期2026/10/1
最少: 1
倍數: 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Ezurio 多協議模組 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
250預期2026/9/21
最少: 1
倍數: 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Texas Instruments 多協議模組 SimpleLink multipro tocol 2.4-GHz wirele
1,968預期2026/9/3
最少: 1
倍數: 1
: 2,000

CC2652RSIP 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External 7 mm x 7 mm BLE ISM Thread, Zigbee Reel, Cut Tape, MouseReel
u-blox 多協議模組 Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
750預期2026/12/31
最少: 1
倍數: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
Seeed Studio 多協議模組 Seeed Studio XIAO nRF52840 Sense(Tape & Reel)
56在途量
最少: 1
倍數: 1

u-blox 多協議模組 Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
250預期2026/10/12
最少: 1
倍數: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
Silicon Labs 多協議模組 Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
1,469在途量
最少: 1
倍數: 1

MGM210P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Seeed Studio 多協議模組 Seeed Studio XIAO nRF52840(Tape & Reel)
58在途量
最少: 1
倍數: 1