SMD/SMT 多通訊協定模組

結果: 350
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說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。
數量 RoHS ECAD模型 系列
頻率
輸出功率
接口類型
電源電壓 - 最小值
電源電壓 - 最大值
最低工作溫度
最高工作溫度
天線連接器類型
尺寸
協議 - 藍牙、BLE (802.15.1)
協議 - 蜂窩、NBIoT、LTE
協議 - GPS、GLONASS
協議 - Sub GHz
協議 - WiFi (802.11)
協議 - ANT、Thread、Zigbee (802.15.4)
封裝
u-blox 多通訊協定模組 IW611, 802.11ax+BT, 1 PCB antenna or antenna pin
規格書
2,507在途量
最少： 1
倍數： 1
最大： 150
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
8,000預期2026/10/8
可選用MouseReel
最少： 1
倍數： 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel
Telit Cinterion 多通訊協定模組
540在途量
最少： 1
倍數： 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
Nordic Semiconductor 多通訊協定模組 Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
規格書
2,500預期2026/12/25
最少： 1
倍數： 1
: 2,500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape
Espressif Systems 多通訊協定模組 2.4 GHz Wi-Fi 6, Bluetooth 5.4 (LE), Bluetooth Classic, Zigbee and Thread (802.15.4) module Built around ESP32-S31 series of SoCs, RISC-V 32-bit dual-core microprocessor 54 GPIOs, rich set of peripherals On-board PCB antenna
規格書
2,490預期2026/10/28
最少： 1
倍數： 1

GPIO, SPI, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11ax
CEL 多通訊協定模組 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK
規格書
3庫存量
最少： 1
倍數： 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Ezurio 多通訊協定模組 Sterling LWB+, MHF4, Tape and Reel
規格書
1,500預期2026/10/2
最少： 1
倍數： 1
: 800

Sterling-LWB+ 2.4 GHz SDIO, UART 3.3 V 3.3 V - 40 C + 85 C 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Reel, Cut Tape
Ezurio 多通訊協定模組 Module, BL54L15, Bluetooth LE, Chip Antenna, Cut Tape
規格書
544預期2026/12/2
最少： 1
倍數： 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio 多通訊協定模組 Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
規格書
1,000預期2026/12/31
最少： 1
倍數： 1
: 1,000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Kaga FEI 多通訊協定模組 WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
規格書
300預期2026/11/17
最少： 1
倍數： 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
Kaga FEI 多通訊協定模組 WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
規格書
300預期2026/11/17
最少： 1
倍數： 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Tray
GigaDevice 多通訊協定模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
規格書
800預期2026/11/20
最少： 1
倍數： 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
GigaDevice 多通訊協定模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
規格書
800預期2027/1/1
最少： 1
倍數： 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice 多通訊協定模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
規格書
800預期2027/1/1
最少： 1
倍數： 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
u-blox 多通訊協定模組 RW612, 802.11ax+BLE+802.15.4, ant pin, open CPU, 16MB
規格書
495預期2027/1/18
可選用MouseReel
最少： 1
倍數： 1
: 250

2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Antenna Pin Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
u-blox 多通訊協定模組 Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
規格書
250預期2026/10/12
最少： 1
倍數： 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox 多通訊協定模組 Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
規格書
750預期2026/12/31
最少： 1
倍數： 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox 多通訊協定模組 IW612, 802.11ax+BT+802.15.4, 1 PCB antenna or ant. pin
規格書
958在途量
可選用MouseReel
最少： 1
倍數： 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape, MouseReel
u-blox 多通訊協定模組 Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
規格書
500預期2026/12/31
最少： 1
倍數： 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Texas Instruments 多通訊協定模組 SimpleLink multipro tocol 2.4-GHz wirele
規格書
1,900預期2026/10/1
可選用MouseReel
最少： 1
倍數： 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Texas Instruments 多通訊協定模組 SimpleLink multipro tocol 2.4-GHz wirele
規格書
1,968預期2026/9/3
可選用MouseReel
最少： 1
倍數： 1
: 2,000

CC2652RSIP 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External 7 mm x 7 mm BLE ISM Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
998預期2026/10/23
最少： 1
倍數： 1
: 1,000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
1,000預期2026/10/23
最少： 1
倍數： 1
: 1,000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
1,070在途量
最少： 1
倍數： 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
規格書
2,860預期2026/9/1
最少： 1
倍數： 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape