多協議模組

結果: 1,632
選擇 圖像 零件編號
 製造商
說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。
數量 RoHS ECAD模型 系列
頻率
輸出功率
接口類型
電源電壓 - 最小值
電源電壓 - 最大值
最低工作溫度
最高工作溫度
天線連接器類型
尺寸
協議 - 藍牙、BLE (802.15.1)
協議 - 蜂窩、NBIoT、LTE
協議 - GPS、GLONASS
協議 - Sub GHz
協議 - WiFi (802.11)
協議 - ANT、Thread、Zigbee (802.15.4)
資格
封裝
Inventek 多協議模組 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/CIC/CE
規格書

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Inventek 多協議模組 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. U.FL for External Antenna. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE
規格書

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C u.FL 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray
Inventek 多協議模組
規格書
暫無庫存
最少： 2,000
倍數： 2,000
: 2,000

2.4 GHz 17 dBm I2S, SPI, UART 2 V 3.6 V - 40 C + 85 C u.FL 10 mm x 10 mm BLE, Bluetooth 5.1 802.11 b/g/n Reel
Inventek 多協議模組 802.11 b/g/n WiFi and BT 4.2 combo and STM32F412 WICED Module with Chip Antenna. Certified FCC/IC/CE
規格書
暫無庫存
最少： 980
倍數： 196

2.4 GHz 17 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C Chip 14.5 mm x 34 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Inventek 多協議模組 802.11 b/g/n WiFi and BT 4.2 combo and STM32F412 WICED Module with U.FL. Certified FCC/IC/CE
規格書
暫無庫存
最少： 980
倍數： 196

BLE, Bluetooth 4.2 802.11 b/g/n Tray
Espressif Systems 多協議模組 Built-in ESP32-S31 series chip. featuring a RISC-V 32-bit dual-core microprocessor. Main pin compatible with ESP32-S3-WROOM-1. Suitable for embedded systems, smart home, wearable electronic devices, and other loT scenarios.
規格書
暫無庫存
最少： 3,250
倍數： 3,250

320 MHz GPIO, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11ax
Espressif Systems 多協議模組 2.4 GHz Wi-Fi 6, Bluetooth 5.4 (LE), Bluetooth Classic, Zigbee and Thread (802.15.4) module Built around ESP32-S31 series of SoCs, RISC-V 32-bit dual-core microprocessor 54 GPIOs, rich set of peripherals On-board PCB antenna
規格書
暫無庫存
最少： 2,500
倍數： 2,500

GPIO, SPI, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11ax
Espressif Systems 多協議模組 ESP32-WROVER-IE integrates ESP32-D0WD-V3, with higher stability and safety performance
規格書
暫無庫存
最少： 3,250
倍數： 650

ESP32-WROVER-IE 2.4 GHz 20 dBm I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C IPEX 18 mm x 31.4 mm x 3.3 mm BLE, Bluetooth 4.2 BR/EDR 802.11 b/g/n
Espressif Systems 多協議模組 SMD module, ESP32-PICO-V3-02 with 8 MB flash and 2 MB PSRAM die inside, ESP32 ECO V3, IPEX antenna
規格書
無庫存前置作業時間 14 週
最少： 6,500
倍數： 6,500
Tray
Insight SiP 多協議模組 ISP3010-UX nRF52832 BLE 5 Module
規格書
暫無庫存
最少： 250
倍數： 250
: 250
2.4 GHz to 2.8 GHz SPI 1.8 V 6 V - 40 C + 85 C 14 mm x 14 mm x 1.5 mm BLE Reel
Insight SiP 多協議模組 ISP3010-UX nRF52832 BLE 5 Module
規格書
暫無庫存
最少： 500
倍數： 500
: 500
2.4 GHz to 2.8 GHz SPI 1.8 V 6 V - 40 C + 85 C 14 mm x 14 mm x 1.5 mm BLE Reel
Insight SiP 多協議模組 ISP3010-UX nRF52832 BLE 5 Module
規格書
暫無庫存
最少： 50
倍數： 50
2.4 GHz 4 dBm SPI 1.8 V 6 V - 30 C + 85 C Built-In 14 mm x 14 mm x 1.5 mm Bluetooth 5.0 Tray
Insight SiP 多協議模組 Global Coverage Ultra Wide Band & Bluetooth 5.1 LE Smart Module Module w/ Built in Antenna
規格書
無庫存前置作業時間 39 週
最少： 500
倍數： 500
: 500

Reel
Insight SiP 多協議模組 nRF52832 LoRa Transceiver & BLE 5 Module AS
規格書
無庫存前置作業時間 36 週
最少： 500
倍數： 500
: 500
1.8 V 3.6 V - 30 C + 85 C Reel
Insight SiP 多協議模組 nRF52832 LoRa Transceiver & BLE 5 Module EU
規格書
暫無庫存
最少： 250
倍數： 250
: 250
1.8 V 3.6 V - 30 C + 85 C Reel
Insight SiP 多協議模組 nRF52832 LoRa Transceiver & BLE 5 Module EU
規格書
無庫存前置作業時間 36 週
最少： 500
倍數： 500
: 500
ISP4520 1.8 V 3.6 V - 30 C + 85 C Reel
Insight SiP 多協議模組 nRF52832 LoRa Transceiver & BLE 5 Module US
規格書
暫無庫存
最少： 250
倍數： 250
: 250
902 MHz to 928 MHz, 2.4 GHz 22 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0 Reel
Insight SiP 多協議模組 nRF52832 LoRa Transceiver & BLE 5 Module US
規格書
無庫存前置作業時間 36 週
最少： 500
倍數： 500
: 500
1.8 V 3.6 V - 30 C + 85 C Reel
Insight SiP 多協議模組 WiFi 6/BLE module based on NXP RW612 chip (in reel)
規格書
無庫存前置作業時間 36 週
最少： 500
倍數： 500
: 500

Reel
Insight SiP 多協議模組
規格書
暫無庫存
最少： 1
倍數： 1
GigaDevice 多協議模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 9.5 x 12.4 / 21 GPIO / -40-85 degC / external IPEX connection
規格書
無庫存前置作業時間 25 週
最少： 1
倍數： 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 12.4 mm x 9.6 mm x 2.4 mm BLE WiFi
GigaDevice 多協議模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-85 degC / onboard PCB antenna
規格書
無庫存前置作業時間 25 週
最少： 1
倍數： 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
u-blox 多協議模組 88W8887, 802.11ac+BT, 1 antenna pin, LTE filter
規格書
無庫存前置作業時間 18 週
最少： 500
倍數： 500
: 500

2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 2.97 V 3.63 V - 40 C + 85 C 19.8 mm x 13.8 mm x 2.5 mm Bluetooth 802.11 a/b/g/n/ac Reel
u-blox 多協議模組 88W8887, 802.11ac+BT, 2 antenna pins
規格書
無庫存前置作業時間 18 週
最少： 500
倍數： 500
: 500

2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 2.97 V 3.63 V - 40 C + 85 C 19.8 mm x 13.8 mm x 2.5 mm Bluetooth 802.11 a/b/g/n/ac Reel
u-blox 多協議模組 Automotive grade host-based Wi-Fi 5 and Bluetooth 5.2 module, -40 C to +105 C
規格書
無庫存前置作業時間 26 週
最少： 500
倍數： 100

JODY-W2 2.4 GHz, 5 GHz 19 dBm GPIO, SDIO, UART 2.8 V 5.5 V - 40 C + 105 C RF 19.8 mm x 13.8 mm Bluetooth 5.2 Reel