congatec 熱量管理

結果: 253
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS
JUMPtec 散熱器 HSP COMe-bSL6 Cu-core threaded 47庫存量
最少: 1
倍數: 1


congatec CPU和晶片散熱器 Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. 8庫存量
最少: 1
倍數: 1

congatec 散熱器 * Passive cooling for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm 91庫存量
最少: 1
倍數: 1

JUMPtec 散熱器 HSP COMe-mAL10 E2 through 55庫存量
最少: 1
倍數: 1
congatec 散熱器 Standard passive cooling for Qseven module conga-QA3. All stand-offs are M2.5 threaded. 97庫存量
最少: 1
倍數: 1



congatec 散熱器 Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole. 13庫存量
最少: 1
倍數: 1

JUMPtec 散熱器 HSP COMe-mAL10 E2 slim thread 144庫存量
最少: 1
倍數: 1
congatec 散熱器 Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0 154庫存量
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 COMe Active Uni Cooler (w/o HSP) 43庫存量
最少: 1
倍數: 1
congatec HPC/sILH-CSA-HP-T
congatec CPU和晶片散熱器 Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5. 1庫存量
最少: 1
倍數: 1
congatec CPU和晶片散熱器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole. 2庫存量
最少: 1
倍數: 1

congatec 散熱器 * Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded 4庫存量
最少: 1
倍數: 1

congatec CPU和晶片散熱器 *Passive cooling for Pico ITX module conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded 2庫存量
最少: 1
倍數: 1
congatec HPC/cALP-HSP-HP-B
congatec 散熱器 Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole. 12庫存量
最少: 1
倍數: 1
congatec 散熱器 Standard heatspreader for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole. 2庫存量
最少: 1
倍數: 1

congatec CPU和晶片散熱器 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread 11庫存量
最少: 1
倍數: 1

congatec CPU和晶片散熱器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole. 5庫存量
最少: 1
倍數: 1

JUMPtec 散熱器 HSP COMe-mBT10 through 6庫存量
最少: 1
倍數: 1
congatec 散熱器 Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. 18庫存量
最少: 1
倍數: 1
congatec CPU和晶片散熱器 Standard active cooling solution and integrated 12V fan for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 3庫存量
最少: 1
倍數: 1
JUMPtec CPU和晶片散熱器 HSK COMe-Basic passive (w/o HSP) 7庫存量
最少: 1
倍數: 1
congatec 散熱器 * Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* With bore hole 2.7mm stand-offs. 3庫存量
最少: 1
倍數: 1

congatec 散熱器 * Standard passive cooling for COM Express Mini Type10 module conga-MA5* Heatstack cooling for modules with standard CPU (open silicone die)* All stand-offs are M2.5 threaded 15庫存量
最少: 1
倍數: 1

congatec 散熱器 Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. 1庫存量
最少: 1
倍數: 1
congatec CPU和晶片散熱器 Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 2庫存量
最少: 1
倍數: 1