Molex VHDM® H系列背板連接器系統
Molex設計的H系列VHDM® （超高密度公制）H系列背板連接器系統適合對極高互連密度和高速訊號 完整性有嚴格要求的應用。VHDM H系列背板連接器系統安裝於基座後可實現高達6.25 Gbps的數據傳輸率，而且無需花費大量資金重新設計結構，即能將系統升級。VHDM® H系列採用與舊版系列完全相同的配接介面和封裝，能夠完全向後兼容現有的VHDM插槽。設計人員透過Molex VHDM® H系列背板連接器系統，可以延長現有平台的使用壽命、降低開發成本，並加快在市場上推出更高性能產品的速度。
特點
- Data rates up to 6.25Gbps
- Mates with existing VHDM® systems to enable backwards compatibility with existing VHDM® slots
- Ability to combine VHDM L-Series (1Gbps), VHDM (3.125Gbps), VHDM H-Series (6.25Gbps) and VHDM-HSD (5Gbps) wafers on the same metal stiffener
- Internal ground shields control impedance and minimize cross talk
- Small compliant-pin 0.45mm (.018”) PCB hole size
- Modular construction maximizes design flexibility via custom configuration of signal, power and guide modules
規格
- 1A signal contact
- Shield Contact:
- 6 Row - 2A
- 8 Row - 3A
- 10A per power blade
- Delivers up to 120.0A per 25mm (.984") of board edge
- Multiple mating levels for hot plug applications
應用
- Telecommunication equipment
- Hubs, switches, routers
- Central office, cellular infrastructure and multi-platform (DSL, Cable Data) systems
- Medical imaging
- Data networking equipment
- Storage
- Servers
- Test and measurement equipment
- Military
Additional Resources
Related Solutions
Molex 資料/運算解決方案
涵蓋多樣化的解決方案，適用於從高階伺服器與工作站，到最先進的儲存裝置。
發佈日期: 2011-02-17
| 更新日期: 2022-03-11