新型熱介面產品
Laird Tgrease™ 3000 Thermal Grease supports the growing demand for higher operating temperatures, especially for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors. This high-performance, high-temperature-stable thermal grease offers 3.2W/mK bulk thermal conductivity and is suitable for temperatures as high as +200°C. The grease can also be used at lower operating temperatures to provide greater overall reliability. Laird Tgrease 3000 Thermal Grease features silicone material filled with thermally conductive fillers, providing superior thermal performance and low pump-out compared to other thermal greases. This product is ready to use out of the container, and no curing is required.
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Qnity Tgrease™ 3000 Thermal GreaseSupports higher operating temperatures (+200°C), especially for SiC and GaN power semiconductors.2026/8/21
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StarTech High-Performance Silicone Thermal PasteDesigned for efficient heat transfer and safe application in various environments.2026/4/8 -
Bourns BTJ Thermal Jumper ChipsUnique surface-mount components that provide high thermal conductivity for thermal dissipation.2026/2/2 -
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.2025/11/6 -
Qnity Tflex™ HR6.5 Thermal Gap FillerThermal interface material with >6W/mK thermal conductivity with high recovery properties.2025/9/15 -
Qnity Tflex™ CR350S 2-Part Dispensable Gap FillersProvide high thermal conductivity, low thermal resistance, and high reliability.2025/9/9 -
Qnity Tputty™ SF560 1-Part Dispensable Gap FillersOffers thermal conductivity of 5.6W/mK, along with superior thermal resistance.2025/8/25 -
Wakefield Thermal ulTIMiFlux Dielectric Phase Change TIMThermally conductive electrical insulators for semiconductor-to-heat sink interfaces2025/7/23 -
Qnity Tflex™ CR550 2-Part Dispensable Gap FillerTransfers unwanted heat in automotive components and the A+B putty material cures in place.2024/10/25 -
Qnity Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.2024/9/10 -
Qnity Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.2024/9/10 -
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.2024/5/30 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.2024/5/27 -
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip ResistorsFeatures chip sizes ranging from 0603 to 2512.2024/1/18 -
MG Chemicals Non-Silicone Liquid Thermal Gel1-part gel that offers extreme thermal conductivity and flame retardancy.2023/10/30 -
LeaderTech TCF 超薄碳纖維導熱墊熱阻低、表面柔軟，主要以碳纖維作為導熱填料。2023/10/18 -
LeaderTech TGN 超薄導熱墊具有低熱阻，由石墨烯和矽樹脂組合而成。2023/10/18 -
LeaderTech TCI 複合銦片在熔點時從固體轉變為液體，並在室溫下再次恢復為固體。2023/10/18 -
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.2023/9/27 -
Qnity CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.2023/9/8 -
Bergquist Company 數據中心應用先進材料有助於熱管理、長期可靠性和應力保護。2023/4/1