新型熱介面產品
Bourns BTJ Thermal Jumper Chips are unique surface-mount components that provide high thermal conductivity while maintaining insulating properties. These jumper chips are designed for thermal conductivity and dissipation in a variety of mobile devices and electronic equipment. The BTJ jumper chips feature high insulation resistance, low capacitance, and operate at -55°C to 155°C temperature range. These jumper chips can simplify complex thermal design and reduce the temperature rise of key devices, thereby improving system-level reliability. Typical applications include power supplies, switching power supplies, converters, amplifiers/RF, GaN, various ECUs, pin and laser diodes, and data servers.
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Bourns BTJ Thermal Jumper ChipsUnique surface-mount components that provide high thermal conductivity for thermal dissipation.2026/2/2
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Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.2025/11/6 -
Laird Technologies Tflex™ HR6.5 Thermal Gap FillerThermal interface material with >6W/mK thermal conductivity with high recovery properties.2025/9/15 -
Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap FillersProvide high thermal conductivity, low thermal resistance, and high reliability.2025/9/9 -
Laird Technologies Tputty™ SF560 1-Part Dispensable Gap FillersDesigned to offer thermal conductivity of 5.6W/mK, along with superior thermal resistance.2025/8/25 -
Laird Technologies Tflex™ CR550 2-Part Dispensable Gap FillerTransfers unwanted heat in automotive components and the A+B putty material cures in place.2024/10/25 -
Laird Technologies Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.2024/9/10 -
Laird Technologies Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.2024/9/10 -
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.2024/5/30 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.2024/5/27 -
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip ResistorsFeatures chip sizes ranging from 0603 to 2512.2024/1/18 -
MG Chemicals Non-Silicone Liquid Thermal Gel1-part gel that offers extreme thermal conductivity and flame retardancy.2023/10/30 -
LeaderTech TCF 超薄碳纖維導熱墊熱阻低、表面柔軟，主要以碳纖維作為導熱填料。2023/10/18 -
LeaderTech TGN 超薄導熱墊具有低熱阻，由石墨烯和矽樹脂組合而成。2023/10/18 -
LeaderTech TCI 複合銦片在熔點時從固體轉變為液體，並在室溫下再次恢復為固體。2023/10/18 -
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.2023/9/27 -
Wakefield Thermal 127-6 High-Performance, Sil-Free Thermal GreaseHigh-performance, non-silicone thermal grease syringe with 6W/m-K thermal conductivity.2023/9/13 -
Laird Technologies CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.2023/9/8 -
Bergquist Company 數據中心應用先進材料有助於熱管理、長期可靠性和應力保護。2023/4/1 -
Laird Technologies Tpcm™ 7000 High-Performance TIMsDesigned to enhance the cooling of the thermal challenges in electronics.2022/8/3 -
Laird Technologies Tflex™ HD7.5 Thermal Gap FillerSoft silicone material that offers high deflection and 7.5W/mK thermal conductivity.2022/8/3 -
Laird Technologies Tpcm™ 5000 High-Performance TIMFeatures low thermal resistance and a non-silicone formulation with a naturally tacky surface.2022/7/19 -
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal GelAssures high thermal conductivity, good dispensing efficiency, and high thermal reliability.2022/7/11 -
Laird Technologies Ttape™ 1000A Thermally Conductive TapePressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.2022/6/3 -
Bergquist Company EV Charging SolutionsDesigned to provide safe charging while protecting EV battery packs from thermal/electrical events.2022/4/13