CPU和晶片散熱器

結果: 305
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (TWD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 高度 深度 寬度 工作電源電壓 額定功率 速度 氣流 軸承型式 系列 特徵
JUMPtec CPU和晶片散熱器 Cooling COMh-sdID (E2): Cooler-LGA115x 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 COMh Size D Active Uni Cooler (w/o HSP) 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 COMh Size D Passive Uni Cooler (w/o HSP) 暫無庫存
最少: 1
倍數: 1

DFRobot CPU和晶片散熱器 Colorful ICE Tower Cooling Fan for Raspberry Pi 暫無庫存
最少: 1
倍數: 1
12 mm 40 mm 5 V 400 mW
DFRobot CPU和晶片散熱器 ICE Tower Cooler for Raspberry Pi 5 Single Board Computer 暫無庫存
最少: 240
倍數: 1

40 mm 35 mm Efficient Cooling
IEI CPU和晶片散熱器 B645;COOLER MODULE;HEATSINK+BLOWER FAN:95*90*27.45mm;STANDARD;00;Q3,FOR LGA1700 SOCKET CPU;COPPER+SCREW SET*4+BACKPLATE+GREASE;DC FAN:12V,7000RPM,CONNECTOR:2.54-4PIN;DYNATRON;DB128015BU-B;CCL;RoHS 暫無庫存
最少: 1
倍數: 1

IEI CPU和晶片散熱器 SAS4;COOLER MODULE/Heat Pipe;HEATSINK+FAN:90*90*68mm;STANDARD;00;HF-XFWD-00668-2211;CU&AL BASE+HEAT PIPE+AL FIN+GREASE;DC FAN:12V,9000RPM,2510-M,225 4P,L=270mm;Geatsink;TD6025B12HA;CCL;RoHS 暫無庫存
最少: 1
倍數: 1

68 mm 90 mm 90 mm 125 W 9000 RPM Ball
IEI CPU和晶片散熱器 B497;COOLER MODULE/Heat Pipe;HEATSINK MODULE:107*81*64.7mm,FAN:60*60*25mm;STANDARD;00;HF-XFWD-00765-2312;AL BASE+AL FIN+PIPE*3+SCREW* 4+GREASE;FOR LGA1151;DYNATRON;LF06250102,12V,8000RPM,2510-4P,L:220mm;CCL;RoHS 暫無庫存
最少: 1
倍數: 1

64.7 mm 81 mm 107 mm 95 W 8000 RPM Ball
IEI CPU和晶片散熱器 IEI customized cooler for LGA1150 Intel CPU,83*83*57,95W,CCL;RoHS 暫無庫存
最少: 500
倍數: 500

57 mm 83 mm 83 mm 95 W 4200 RPM Ball, Sleeve
IEI CPU和晶片散熱器 High Performance Socket-G (PGA989) CPU Cooler, Copper, 55W,CCL,RoHS 暫無庫存
最少: 500
倍數: 500

28 mm 60 mm 60 mm 12 VDC 55 W 4800 RPM Ball
APC by Schneider Electric CPU和晶片散熱器 InRow RD, 300mm, Air Cooled, 220-240V, 50Hz
300 mm 300 mm 220 VAC to 240 VAC
APC by Schneider Electric CPU和晶片散熱器 InRow RD, 300mm, Fluid Cooled, 220-240V, 50Hz
300 mm 300 mm 220 VAC to 240 VAC
congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors.All standoffs are M2.5x0.45p threaded. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 *Passive cooling for Pico ITX board conga-PA7*For boards with IHS CPU*Four stand-offs threaded M2.5 暫無庫存
最少: 1
倍數: 1

conga-PA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. bore hole 暫無庫存
最少: 1
倍數: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium and Celeron processor. bore hole 暫無庫存
最少: 1
倍數: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium and Celeron processor. thread 暫無庫存
最少: 1
倍數: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COMe mini module conga-MA7 with open-die Intel Pentium/Celeron Nxxx processor. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
conga-MA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COMe mini module conga-MA7 with open-die Intel Pentium/Celeron Nxxx processor. All standoffs are M2.5 threaded 暫無庫存
最少: 1
倍數: 1
conga-MA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 * Passive cooling solution for SMARC 2.0 module conga-SA7* For modules with open-die Intel Pentium/Celeron processor* All stand-offs are with 2.7mm bore hole 暫無庫存
最少: 1
倍數: 1
conga-SA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 無庫存前置作業時間 14 週
最少: 1
倍數: 1
25.5 mm 12 V conga-TC570 Intel Tiger Lake-UP3
congatec CPU和晶片散熱器 Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. 暫無庫存
最少: 1
倍數: 1
25.5 mm 12 V conga-TC570 Intel Tiger Lake-UP3